LAMP2019 TOPICS Tentative as of 2018-4-24-003

LPM Topics

1. Fundamental aspects

(Dynamics, modeling, simulation, etc.)

2. Process monitoring and control

3. Laser and photochemistry

4. Nanotechnology

5. Laser-based direct-write techniques

6. Ultra-short pulse laser processing

7. VUV laser and X-ray processing

8. Surface treatment (Texturing, cleaning,

annealing, modification, etc.)

9. Advanced laser processing

(Fiber laser, disc laser, FEL, etc.)

10. Micro-patterning and micro-structuring

11. Nano ripple formation

12. Micro-machining

13. 3-D micro- and nano-fabrication

14. Drilling and cutting

15. Micro-welding and micro-bonding

16. Micro-forming

17. Wafer dicing

18. Marking and trimming

19. Glass/Ceramic processing

20. Packaging and mounting process

21. Lithography

(including EUV source and application)

22. Manufacture of micro devices and

systems

23. Film deposition and synthesis of

advanced materials (PLD, CVD, etc.)

24. Nano- and micro-particles

25. Medical and biological applications

26. Optics and systems for laser

microprocessing

27. Laser devices

28. Beam shaping

29. Industrial applications

30. Others

31. LPM Special Session (L1) TBA

32. LPM Special Session (L2) TBA

33. LPM Special Session (L3) TBA

HPL Topics

1. Fundamentals of laser-materials interactions

2. Laser-induced plasma/plume

3. Gas laser

4. Solid-state laser (YAG, Fiber, Disk, etc.)

5. Diode laser

6. Green or blue laser

7. Optics

8. Beam delivery system

9. Monitoring and control (including OCT)

10. Metallurgical and mechanical aspects

11. Modeling and simulation

12. Cleaning

13. Surface modification

(Hardening, quenching, alloying, etc.)

14. Cladding and rapid prototyping

15. Additive manufacturing (3D Printer)

16. Welding

17. Welding of thick plate

18. Welding of high strength steel

19. Welding of light metals and alloys

20. Joining of plastics, glasses or ceramics

21. Joining of dissimilar materials

(plastic to metal)

22. Joining of battery or fuel cell

23. Remote welding

24. Hybrid welding

25. Brazing and soldering

26. Drilling (High speed and high quality)

27. Cutting (of CFRP, etc.)

28. Thick plate cutting and dismantling

29. Industrial applications

30. Innovative applications

(Sandwich panel, etc.)

31. Present status and future prospects

32. Others